Product Info

Carbide Sputtering Target

TiC, SiC, WC, WC-Co, B4C, TaC, ZrC, Cr3C2, HfC, Mo2C, VCServe as the raw materials for the sputter deposition of a variety of thin films and coatings used in the microelectronic, flat panel display, data storage, optical glass coating, and other industries, the core process technologies used in coating material and target manufacturing include:Casting (vacuum or atmospheric), rolling, forging (hot / cold), pressing (cold, hot, uniaxial or isotropic), sintering, spraying (plasma, wire). CAM runs all these process technologies, including cutting, milling, sawing, grinding, etc.1.) Oxide sputtering target:La2O3, CeO2, Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb4O7, Dy2O3, Ho2O3, Er2O3, Tm2O3, Yb2O3, Lu2O3, Sc2O3, Y2O3, Ta2O5, Nb2O5, Ga2O3, V2O5, ZrO2 doped with Ti, WO3, WO2.9, HfO2, MgO, Al2O3, Indium Tin Oxide, ITO (In2O3-SnO2), ZnO, Al2O3 doped ZnO (AZO), IZO (Indium Zinc Oxide, 90 wt% In2O3 / 10 wt% ZnO), Ga2O3 doped ZnO (GZO), IGZO, La0.67Sr0.33MnO3 (LSMO), ZrO2-Y2O3 stabilized (YSZ), YBCO, ZrO2+Ti, ZrO2+Zr, ZrO2+SiO2, Bi2O3, Cr2O3, MoO, MoO3, NiO, SiO, Cr-SiO, SiO2, TiO, TiO2, TiO2-Nb2O5, Ti2O3, Ti3O5, CuO/Al2O3, Sb2O3, BaO, BaTiO3, CaO, Fe2O3, Fe3O4, PbO, PbTiO3, PbZrO3, LiNbO3, SrO, SrTiO3, SrZrO3, SrBaTiO3, PZT (Plumbum Zirconate Titanate), SrRuO3, LaNiO3, InGaZnO, CuInO2, LaAl2O3.2.) (Boride, Carbide, Nitride, Fluoride, Silicide, Sulfide) sputtering targetLaB6, ZrB2, CrB2, TiB2, HfB2, Mo2B5, TaB2, NbB2, W2B, WB, VB2TiC, SiC, WC, WC-Co, WC-Ni, B4C, TaC, ZrC, Cr3C2, HfC, Mo2C, VCSi3N4, AlN, BN, BN/SiC mixture, HfN, TaN, NbN, ZrN, TiN, VNLaF3, CeF3, NdF3, YF3, NaF, KF, BaF2, AlF3, LiF, CaF2, SrF3, SrF2, MgF2CoSi2, Mo5Si3, MoSi2, Ta5Si3, TaSi2, Nb5Si3, NbSi2, CrSi2, Cr3Si, HfSi2, TiSi2, Ti5Si3, ZrSi2, WSi2, VSi2, V3Si, NiSi,CdS, ZnS, ZnS:Mn, In2S3, Sb2S3, PbS, MoS2, TaS2, WS23.) Metal sputtering target:Gold, Au, Silver, Ag, Osmium, Os, Platinum, Pt, Palladium, Pd, Iridium, Ir, Ruthenium, Ru, Rhenium, Re, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Sc, Y, Silicon, Si, Tellurium, Te, Bismuth, Bi, Tin, Sn, Zinc, Zn, Sulphur, S, Graphite, C, Boron, B, Lead, Pb, Antimony, Sb, Selenium, Se, Chromium, Cr, Cobalt, Co, Aluminum, Al, Nickel, Ni, Titanium, Ti, Tungsten, W, Molybdenum, Mo, Tantalum, Ta, Niobium, Nb, Zirconium, Zr, Hafnium, Hf, Vanadium, V, Germanium, Ge, Indium In, Copper, Cu, Iron, Fe, Manganese, Mn, , Magnesium, Mg, Barium, Ba, Cadmium, Cd, Calcium, Ca, Strontium, Sr.4.) Alloy sputtering target:Cr-Al, Co-Mn-Ge, Mg-Sm, Al-Sm, Mg-Nd, Mg-Nd-Zr-Y, Mg-Sc, Mg-Zr, Al-Nd, Mg-Gd, Al-Gd, Mg-Dy, Al-Dy, Al-Sc, Mg-Ca, Al-Ca, Mg-Y, Al-Y, NiYb, Ni2Yb, Ni3Yb, Ni-Yb, LaNi, La-Ni, Co-Ni, V-Ni, Cr-Ni, Ti-Ni, Fe-Ni, Co-Ni-Cr, Co-Cr-Ta, Ho-Cu, Ce-Cu,Ce-Ag, Nd-Ag, Fe50Mn50, Ni81Fe19, Ce-Gd, Sm-Fe, Sm-Co, Sm-Zr, Gd-Fe, Gd-Tb, Fe-Hf, Tb-Fe, Dy-Fe, Dy-Co, Gd-Fe, Gd-Fe-Co, Dy-Fe-Co, Tb-Fe-Co, Nd-Fe-Co, Nb-Zr, Zr-Al, Al-Ta, Al-V, Al-Mo, Al-Si, Al-Cu, Al-Si-Cu, Al-Ti, Al-Ag, Al-Mg, Al-Mg-Si, Al-Si-Cu, Zn-Al, Ce-Gd, Ce-Sm, CoZr, CoCr, CoNi, CoPt, CoNiCr, CoNiPt, Co-Fe, FeCoB, CoTaZr, CoNbZr, CoCrMo, CrV, CrB, CrSi, Cr-Cu, In-Sb, InAs, InP, InSn, MnFe, MnNi, NdDyFeCo, Ni-Cr, Ni-Mn, Ni-Cr-Si, Ni-Cr-Fe, Ni-Fe, Ni-Ti, Ni-V, Ni-Al, TbGdFeCo, TiAl, Ti-Si, Ti-Al, Ti-Al-Y, Ti-Al-V, Ti-Ni, Ti-Zr, TiSi2, W-Ti, W-Si, V-Al, Zr-Ti, Zr-Ni, Zr-Nb, Zr-Al, Zr-Cu, Zr-Y.EVAPORATION MATERIALSLa2O3, CeO2, Pr6O11, Nd2O3, Sm2O3, Gd2O3, Dy2O3, Er2O3, Sm2O3, Yb2O3, Y2O3, LaF3, CeF3, PrF3, NdF3, SmF3, GdF3, DyF3, ErF3, YbF3, ScF3, YF3, HfO2, CaF2, ZnS, CdS, SiO2, HfO2, ZrO2, TiO2, TiO, Ti2O3, Ti3O5, Ta2O5, Nb2O5, SiO2, Al2O3, MgO, ZnO, WO3, Bi2O3, Sb2O3, Cr2O3, NiO, CuO, Fe2O3, V2O5, BaTiO3, SrTiO3, PrTiO3, LaTiO3, MgF2, BaF2, SrF3, CaF2, KF, NaF, ZnS, CdS, ZnSe.

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